Ljepila
Thermally conductive adhesives
Electronic devices which get smaller, lighter, and always better in performance. This trend towards electronics miniaturization has been and always will be one of the driving forces for improved thermal dissipation materials.
ROARTIS® has developed a range of 1-komponent, as well as 2-komponent thermally conductive materials, which help in dissipating the heat. All of the electrically conductive materials, based on Ag-metal fillers, have thermal conductivities > 5 W/m.°K.
The list of products below are insulating materials, combined with very small thermally conductive fillers, ideal for those applications where the heat must be dissipated away from temperature sensitive components, by means of very thin bondlines.
- IQ-BOND 2800-T
- IQ-BOND 2231-T
- IQ-BOND 2612-T-FC
- IQ-BOND 2800-T
- IQ-BOND 2231-T
- IQ-BOND 2612-T-FC
