Underfill encapsulants

Underfills are typically epoxy-based materials which are used in electronic assemblies to fill the gap between BGA-, CSP- or flipchip-components and the printed circuit board. As such, these components are protected against shock, drop, thermal-cycling and vibration impact.

ROARTIS® offers a range of capillary underfills with unique features such as high Tg, low CTE and good flow, even for very small gap applications.