Roartis IQ-BOND 2800-T

  • IQ-BOND 2800-T - Thermally conductive adhesives

IQ-BOND 2800-T is a solvent-free, one-component, pre-mixed, thermoset epoxy based adhesive, developed for applications where thermal conductivity is required.
The rheology is optimized for dispensing, which enables high volume automatic assemblies, but also manual hand-dispensing, as well as stamping processes are feasible.
IQ-BOND 2800-T has a high adhesion strength to the substrate finishes commonly used in microelectronics applications. It is an alumina-filled epoxy-adhesive, which can be used for military hybrid die and component attach, as well as demanding industrial applications.
For optimum curing performance, it’s recommended to do the cure process in a conveyor belt or convection oven, as well as IR-ovens.
Unlike many other single-component adhesives, characterized by a short potlife, IQ-BOND 2800-T has a long potlife of > 1 week at room temperature.
When fully cured, IQ-BOND 2800-T is resistant to moisture, cleaning agents and dilute acids and bases. Also it exhibits very good high thermal resistance, for example typical SnPb-, as well as lead-free soldering processes. As such, IQ-BOND 2800-T will easily resist temperatures up to 260°C-300°C, for short times.
IQ-BOND 2800-T is a solvent-free, 100% solids material and RoHS / REACH compliant.
For cleaning un-cured IQ-BOND 2800-T from stencils, screens, squeegee, or other equipment, the use of IQ-CLEANER 9500 is recommended.
Product properties:
  • Appearance: White paste
  • Chemistry: Epoxy
  • Odor: Faint
  • Mix-Ratio: Not Applicable – pre-mixed “one component” adhesive
  • Fineness: < 30 μm
  • Viscosity: ~ 85.000 mPa.s (CP52, RVII – at 25°C / 0,3 rpm)
  • Thyxotropic Index: > 2,5
  • Filler-content (wght %): ~ 57
  • Thermal Conductivity: ~ 1,0 W/m.K
  • Adhesion Strength: > 200 kg/cm²
  • Cure Speed:
    • 60 minutes @ 180°C (~10 MPa – Alu/Alu lapshear)
    • 90 minutes @ 130°C (~7 MPa – Alu/Alu lapshear)
    • 90 minutes @ 130°C + 72hrs. @ 105°C (~12 MPa – Alu/Alu lapshear)
For good mechanical strength, cure according above conditions is recommended, and a minimum of 120°C required. The final bond strength will depend on the residence time at the given cure temperature. Typically, a higher curing temperature, as well as a longer cure time will result in higher adhesion strength, and improved polymer crosslinking.
  • Dissipation-Factor: > 5
  • Volume Resistivity: ~ 1014