Roartis IQ-BOND 2640-FC

  • IQ-BOND 2640-FC - Structural adhesives

IQ-BOND 2640-FC is a medium viscosity, fast-curable, two-component, epoxy based adhesive, for bonding electronic and/or industrial components, within only a few minutes, at room temperature.
Its chemistry has been especially selected to provide very fast cure properties, combined with good adhesion on a wide variety of substrates.
When properly cured, IQ-BOND 2640-FC provides long term reliable bonds over a large range of temperatures, up to 100°C.
IQ-BOND 2640-FC can be cured at room temperature, in about 5 - 10 minutes, depending the quantity of adhesive used. Higher adhesive quantities will accelerate the curing cycle even more, due to the exothermic nature of the adhesive, when bringing part A and part B together.
When fully cured, the IQ-BOND 2640-FC is resistant to moisture, most cleaning agents and dilute acids and bases. The epoxy-based chemistry provides good adhesion strength on a variety of substrates, such as metals, ceramics, glass and a variety of plastics.
Its chemistry has been selected to enable temperature resistance up to 100°C, depending the geometries and materials of the component to be bonded.
IQ-BOND 2640-FC is REACH and ROHS compliant.
Typical properties of mixed IQ-BOND 2640-FC:
  • Mix-Ratio by weight: 100 parts A + 100 parts B
  • Appearance: Yellowish Paste
  • Chemistry: Epoxy
  • Mixed Viscosity: ~ 15.000 mPa.s (Brookfield RVII – CP51 – 25°C – 2 rpm)
  • Worklife / Potlife: 4 minutes at 25°C
  • Hegmann Fineness: Unfilled
  • Density: ~ 1,15 gr/cc
  • Possible cure profiles:
    • 5 - 10 min @ 25°C
    • 1 - 2 min @ 50°C
For good mechanical strength, cure according above conditions is recommended. For best performance, a post-cure of 2 hours at the highest expected use temperature is recommended.
Typically, a higher curing temperature, as well as a longer cure time will result in higher adhesion strength, and improved polymer crosslinking.