10th ASYS GROUP TECHNOLOGY DAYS
14. - 15. November 2018
Expirience at this year's Technology Days in a comprehensive program of lectures, keynote speakers and live demos how ASYS creates the production of the future!
https://www.asys.de/tech-days/en/program.html
We inform you that Asscon product VP 450 and Quicky 300 will be phased-out. As their replacement, Asscon will present their new upgraded machines VP 510 and VP 310 on Productronica 2017 show.
IPC A-610 seminar, Branik, Slovenia, December 5th - 7th/8th 2017
During the seminar, participants will learn to handle the IPC-A-610 standard, as well as the criteria for optical inspection of electronic assemblies, which is very useful for time and money savings.
You can download the invitation here.
Amtest is organizing a free seminar about ASYS, EKRA and PVA products. The seminar will take place in Kranj, Slovenia on September 27th 2016.
Topics at the seminar will be:
IPC A-610 seminar, Branik, Slovenia, October 25th - 27th/28th 2016
During the seminar, participants will learn to handle the IPC-A-610 standard, as well as the criteria for optical inspection of electronic assemblies, which is very useful for time and money savings.
You can download the invitation here.
Visit us at the Technical fair Belgrade 2016 - 60th International Fair of Technique and Technical Achievements.
More information can be found here: UFI 2016 info
Visit us at IFAM Slovenia 2016 - International trade fair for Automation, Robotics and Mechatr
More information can be found here: IFAM Slovenia 2016 info
We are delighted to inform you that Totech won the SMT award in the category of logistics solutions.
Video of the event at the link: https://www.youtube.com/watch?v=NIcNOSxcGlc
Our partner Hanwha Techwin will present for the first time, at this year's Productronica, the new High Precision Chip Shooter - model DECAN S2.
More details about the machine and the enhacements in comparison to other models from the DECAN series can be found here: DECAN S2 presentation
Visit us at Productronica 2015 – world’s leading trade fair for electronics development and production
More information can be found here: Productronica info 2015
Enhance your inspection capabilities and get a whole lot more FREE when ordering award-winning Mantis Elite, or Mantis Elite-Cam HD eyepiece-less stereo microscopes. Choose one of two great offers below. Promotion ends Friday 18th December 2015. More info on following link.
The Hanhwa Group recently bought the company Samsung Techwin and changed its name to Hanhwa Techwin. Hanhwa, as a Fortune Global 500 company with the 2014 turnover of over 42 billion American dollars, is a global business conglomerate that is evolving intensively in following business areas: chemical industry, advanced materials, mechatronic and air industry, solar energy, construction and car technology.
Find out more about Hanhwa Techwin.
Flying Probes S2 deliver full flexibility of use. The same system can be integrated into automatic production lines, or equipped with standard board loader/unloader magazines, or used manually. Without any mechanical adjustment. SPEA offers full coverage with new test capabilities.
Find out more about SPEA Flying Probes S2.
Asys has released new VEGO Dynamic AMS 03 Speed magazine loader with capacity for two magazines.
Find out more about new VEGO Dynamic AMS 03 Speed.
Parmi presents Jet SPI Defect Repair. With new JET dispenser unit you can eliminate rework and scrap and improve return on investment.
Find out more about Jet SPI Defect Repair.
Prezentacije sa seminara održanog u Zagrebu su dostupne za pregled.
Za prezentacije kliknite ovdje.
Presentations from seminar held in December in Zagreb are available for download.
For more informations please click here.
ASYS Group Technology days 2014 will take place on November 12th and 13th in Dormstadt/Ulm.
For more information about the program of the event, click here.
Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, announces the opening of a new Applications and Training Center.
The new facility, in close proximity to the Technical University of Munich (TUM) and renowned research institutes, will be based in The Gate Garching, a cluster of high-technology companies. This location offers an innovative environment upon which to build and expand. Garching is conveniently located eight minutes from the Munich airport, just off of the Autobahn A9 (Garching Nord), and with a U-Bahn station close by.
Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructures, industrial and medical, and achieves the most stringent requirements in terms of accuracy, repeatability, speed and quality.
Amtest is organizing seminar abour Indium, Asscon, Heller and LPKF products. Seminar will be held in Zagreb, Croatia on 3rd of December 2014.
If you need more information click here.
Amtest is organizing a free advanced programming training for ViTechnology AOI.
The training will be held in Munchen and take place from 1.-5.12.2014.
Find out more about this training.
Amtest is organizing seminar abour Henkel products. Seminar will be held in Kranj, Slovenia
If you need more information click here.
Training for IPC A-610, Branik, Slovenia, September 16th – September 18th/19th 2014
During the seminar participants will learn handling with the IPC-A-610 as well as criteria for the optical inspection of electronic assemblies. That is helpful to evaluate assemblies by saving costs and time. Handling with IPC-A-610
Download invitation for seminar here.
Amtest is proud to present new section in our product line. Industrial tools by Atlas Copco Product lines.
Since vapor phase reflow soldering systems set standards in the soldering technology and vapor phase soldering is the ideal process for modern soldering technology, we have prepared two articles for you to see how Asscon sees this technologies.
Find out more about Electronic manufacturing for less than 2EUR/h - the vapor phase soldering system VP800
Find out more about Simple, efficient, safe - vapor phase soldering
Check out our vapor phase soldering products.
We are proud to announce that Heller Industries and Kyzen corporation won service excellence award in 2014.
Heller Industries won award for soldering equipment, while Kyzen won the award for cleaning/processing materials.
Find out more about Heller products.
Find out more about Kyzen products.
Amtest is proud to present new Samsung label feeder for SM series.
Find out more about Samsung Label Feeder for SM series.
Amtest is proud to present new wires from Balver Zinn.
Find out more about Brilliant B2102 soldering wire.
Find out more about μ-wire Brilliant B2012 soldering wire.
Amtest presents new selective soldering systems from SEHO.
SEHO selective soldering systems are featured with innovative details and convince with perfect soldering results.
SEHO PowerRepair is a semi-automatic repair system for precise desoldering and soldering of through-hole components.
SEHO SelectiveLine and SEHO SelectLine are flexible miniwave soldering systems.
Find out more about SEHO selective soldering systems.
ViTechnology has released SigmaLink import module for easier programming.
Find out more about ViTechnology's SigmaLink.
Amtest offers stereo & ergonomic 3D inspection microscopes, systems for digital inspection and portable magnification and measuring systems.
Find out more about Vision Engineering microscopes.
Amtest is proud to present new P&P machine from Samsung - DECAN F2.
DECAN F2 is a new high speed wide range placer.
Find out more about Samsung DECAN F2.
Amtest is proud to present new printing platform Ekra Serio 4000. The platform contains 3 printer models – SERIO 4000, SERIO 4000 Compact and SERIO 4000 Volume.
Find out more about Ekra Serio 4000.
Amtest is proud to present a new catalog with all the SMT equipment and materials Amtest provides for SMT production.
If you would like to get our new catalog, please send us the request.
Amtest presents new Autotronik pick&place machine BA392V2.
Find out more about Autotronik BA392.
Amtest presents new Autotronik BA684 pick&place machine with dual gantry 4 heads and placement rate up to 10500 cp/h.
Find out more about Autotronik BA684.
Amtest is proud to present new machines from Asys, Riebesam and Mafac.
Find out more about Asys VEGO handling systems.
Find out more about Asys DIVISIO depaneling systems.
Find out more about Asys INSIGNUM marking systems.
Find out more about Riebesam, solvent based systems for metal cleaning.
Find out more about Mafac, water based systems for metal cleaning.
Amtest is proud to present screen and stencil printers from Ekra (Asys group).
Find out more about Ekra screen and stencil printers.
We are proud to present SPECTRO series in Automated Optical Inspection from Vi Technology.
SPECTRO Serie from ViTechnology is a new illumination system with white axial and tri-color peripheral high intensity LED with 4.75µm resolution, FOV 1.1 [2.40] x 44.9 [1.76] and fast cycle time.
Find out more about SPECTRO.
Amtest is proud to present new Totech Dry Tower.
Totech has new brochures. For more information please visit our Totech section.
Watch new video for Totech Dry Cabinets XSD series.
Totech introduced newly optimized drying process along with the dynamic drying unit Closed-Loop regeneration.
Find out more.
Fully automatic cleaning system for stencils, solder frames, squeegees and misprints.
Download informative CL430 news flyer.
Find out more about Systronic cleaning equipment.
Totech Super Dry® was awarded a 2012 Global SMT Technology Award at this year’s SMTAI conference in Orlando.
The award was in recognition of the XSD Series desiccant dry cabinets. Designed to exceed the formidable challenges associated with IPC J-STD-033C and 1601 for handling Moisture Sensitive Devices, XSD desiccant cabinets deliver a process combining ultra low humidity (<0.5%) and mild temperatures (40-60C) proven to replace traditional oven baking of components and boards at a fraction of the cost. (10%) Unlike other desiccant cabinets with heaters, the Super Dry XSD cabinets can dry BGAs, PCBs and other moisture sensitive devices at oven-equivalent speeds without oxidation and inter-metallic growth induced by traditional baking temperatures. Oxidation is a significant drawback of baking components and even a single bake cycle at typical 125o will significantly increase wetting time. Unlike vacuum or baking ovens, the XSD cabinets also offer cost effective unlimited MSD safe storage in full compliance with 033C specifications. They are the industry’s only insulated cabinets.
Download full article.
Amtest is proud to present Systronic cleaning machines as NEW solution for stencil and solder frames cleaning.
Find out more about Systronic cleaning equipment.
The operator enters the favored temperature profile in the soldering system control. The soldering system auto-adjusts the parameters as needed for this favored profile and runs these parameters automatically. The temperature of the assembly is measured continuously via sensors and the energy needed for the soldering process is adjusted atomically To guarantee constant process conditions and repeatable temperature profiles the sensors are cooled down before the beginning of a soldering cycle to the same starting temperature.
Your benefits:
- No more complex generation of temperature profiles.
- The temperature profile is measured during every soldering cycle and can be stored for documentation purposes.
- Perturbation e.g. from different loading are getting eliminated.
- Reliable measured values.
- Leaded applications can be soldered with free programmable end temperature in a lead-free process environment.
Download AUTOPROFILING informative flyer.
The main causes for gaseous voids remaining in the solder joint during later production processes are therefore traced back to the outgassing of components, printed circuit boards and basic materials, as well as reactive gas released in the removal of oxide layers through the fluxing agent.
The multivacuum process helps to effectively remove these voids from the still liquid solder joint by allowing assemblies to be subjected to several independently controllable vacuum processes in a short-term sequence. Multiple successive evacuations shift voids encapsulated in the solder joint in a manner ensuring that they reach its periphery, where they can be removed very effectively. Especially with large soldered joints, this enables the elimination of a significantly greater number of voids than would be the case with a single vacuum operation alone.
The multivacuum process in particular also enables void-free solder joints where products with an above average outgassing potential are concerned (e.g. high number of layers in multilayer, large processors). Gases entering to the solder joint in a first vacuum stage can additionally also be effectively removed from the still liquid solder joint in subsequent vacuum stages.
Besides this the multivacuum process also offers the additional essential advantage of minimizing the risk of soldering defects. If a large void is exposed to vacuum too quickly or if the vacuum is too intense, this can often lead to solder balls, bridging and, in extreme cases, even a dislocation or blowing of, literally, of the components. The multivacuum process now allows these large voids to be exposed to several graded vacuum cycles in an extremely short processing time. This means that the void can be removed from the solder joint in several small steps, obviating the soldering defects mentioned above.
Applications of the Future
The applications of the future will call for electronic assemblies of the highest efficiency. Electromobility, regenerative energies, aerospace, medical and military applications – they all demand top performance from their electronic components. Without an optimal connection of the components which allows for maximum performance whilst simultaneously conducting any generated heat away, meeting these requirements can no longer be assured. The component and connection geometries have already undergone significant change and will also continue to change in future. Power electronics assemblies require correspondingly large connecting pads. But in addition to this they also call for void-free solder joints if the assembly is to achieve maximum efficiency. This makes the task of ensuring void-free solder joints in vacuum soldering processes all the more difficult.
3D-MID applications will also come to play an even more central role in the optimization of electronic components and realization of sustainable products. In this respect, the most extensive void elimination achievable in solder joints using temperatures that are homogenous and as low as possible can only be ensured by vacuum soldering in the vapour phase.
The multivacuum soldering process gives the answer to the challenges of future products and is another milestone from ASSCON in the vacuum soldering technology. It overcomes the limits of modern soldering processes and starts the future of electronic assembling. See for yourself and get convinced of the results that can be achieved with this process!
Multivacuum - the future of soldering.
Amtest is proud to announce cooperation with SPEA. We offer you automatic test equipment, such as flying probe testers and ICT board & power testers.
Find out more about SPEA automatic test equipment.
Amtest is proud to present ELMA ultrasonic equipment as NEW solution for cleaning challenges.
Ultrasonic technology has a long and successful tradition with cleaning challenges in very wide spectrum of industries. Except electronics industry, ultrasonic equipment can be used in numerous industry fields: metal finishing industry, remanufacturing, optics, watch production/repair, jewelry cleaning, medical and dental facilities.
Download ELMA informative flyer.
Find out more about ELMA ultrasonic equipment.
Amtest is proud to present Riebesam spray in air machines for PCB cleaning.
Because of constant demands for high quality products, PCB cleaning becoming standard part of every electronics production. In order to fulfill newest requirements on electronics market Amtest is offering Riebesam machines as simple solution for PCB cleaning.
Find out more about Riebesam cleaning machines.
Kyzen presents new, extremely effective, fast drying stencil cleaner.
Download E5615 informative brochure.
Find out more about Kyzen cleaning materials.
Samsung has released new flexible P&P models: SM481 & SM482.
Find out more about new Samsung SM481 machine.
Find out more about new Samsung SM482 machine.
Amtest offers new bench-top pick&place BS281 machine from Autotronik.
Find out more about Autotronik BS281 machine.
Amtest is proud to present PARMI SPI products.
SPI is dedicated to detecting and filtering the print problems in the printing process, and providing accurate print information feedback and intelligence to improve and stabilise the printing process. Most SPI systems in the market are restricted to the detection of defect pads only, but this alone cannot maximize the uses of SPI for ROI.
PARMI differs from the competition: not only does it ensure perfect defects detection, but it also provides the functions for process innovation to remove the original causes of defects in the printing process.
Find out more about PARMI SPI's.
Samsung introduces new high performance chip shooter.
Find out more about new Samsung SM471 machine.
We have a new web page which contains useful and interesting informations about Totech products.
Find out more about dry cabinets usage.
Kyzen has been awarded a 2012 NPI Award in the category of Cleaning Materials for Aquanox A4638 Advanced Packaging Cleaning Chemistry.
Aquanox A4638 was developed to rapidly dissolve water soluble polar flux residues and exhibits a low surface tension. A4638 is a non-hazardous, biodegradable aqueous solution that contains no CFCs or HAPs.
Find out more about Kyzen cleaning materials.
Kyzen Proves Continued Commitment to Service with 6th Excellence Award
NASHVILLE - Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has been awarded a 2012 Circuits Assembly Service Excellence Award in the category of Cleaning/Processing Materials for its outstanding customer ratings, as judged by its own customers.
Circuits Assembly Editor-in-Chief Mike Buetow presented the award to Tom Forsythe, Vice President of Kyzen, during a Tuesday, February 28, 2012 ceremony that took place at the San Diego Convention Center in California during the 2012 IPC APEX Expo.
Find out more about Kyzen cleaning materials.
This article refers to significance of Samsung Feeder calibration and effects which it has on placement productivity:
http://www.csccom.co.kr/smt/1203/english/8.html
Samsung tool for calibrating feeders, Feeder Calibration Jig, is available as demo equipment in Amtest portfolio.
KIC announces that it has been awarded a 2012 Circuits Assembly
Find out more about KIC products.
