AUTOTRONIK 281 model is especially designed for small volume batch sizes. This model features vision processing and head-mounted camera for non-contact “Vision on the Fly” alignment. It assures high-precision placement of a full range of SMDs, from the smallest 0201 devices through CSPs, µBGAs, flip-chips, ultra-fine pitch 0.5mm for QFPs, even odd-form components.
Optional Bottom Vision Camera is used for large components up to 150 x 100 mm and devices with alignment features on their bottom side. With additional Bottom Vision Camera, the alignment of 01005 components is possible.
Optional Feeders and Accessories allow a wide variety of configurations for Full and Partial Reels of Tape, Strips of Cut Tape, Stick/Tube, and IC Tray Packaging.
- Number of Heads (Vision on the Fly): 1
Placement rate (under the optimum condition):
- 3000 cph
- 2500 cph (IPC 9850)
- Feeder capacity (8 mm): up to 64 Tape Feeders
- IC Tray capacity: up to 3 Waffle Trays
- Component Sense: Vision detection
- Component Size:
Handled by head camera: - Smallest: 0.6 x 0.3mm
- Largest: 16 x 14 mm
Handled by fixed Bottom Vision Camera (option): - Smallest: 0.4 x 0.2 mm
- Largest: 150 x 100 mm
- without Waffle Tray: Max. 320 x 415 mm
- with 1 Waffle Trays: Max. 320 x 270 mm