Roartis IQ-BOND 2400
IQ-BOND 2400 is a solvent-free, one-component, pre-mixed, thermoset epoxy based adhesive, developed for stencil and/or screen printing applications.
It has been designed specifically for the bonding of surface mount devices (SMD), to printed circuit boards, prior to the wave soldering process. Characterized by excellent stencil printability, resulting in high dot profiles, without aperture-stringing or tailing. Also, it’s chemistry has been selected to provide good green strength, resulting in optimum pick & place performance of all common SMD components.
The chemistry of IQ-BOND 2400 has been selected to resist temperatures over 200°C for short periods of time, and has been used in lead-free solder processes with peak temperatures as high as 270°C.
Unlike many other single-component adhesives, characterized by a short potlife, IQ-BOND 2400 has a very long potlife of > 1 month at room temperature.
When fully cured, IQ-BOND 2400 is resistant to moisture, cleaning agents and dilute acids and bases. Also it exhibits very good high thermal resistance, for example typical SnPb-, as well as lead-free soldering processes.
IQ-BOND 2400 is a solvent-free, 100% solids material.
For cleaning un-cured IQ-BOND 2400 from stencils, screens, squeegee, or other equipment, the use of IQ-CLEANER 9500 is recommended.
- Appearance: Yellow Thyxotropic Paste
- Chemistry: Epoxy
- Odor: Faint
- Mix-Ratio: Not Applicable – pre-mixed single component adhesive
- Fineness: < 20 μm
- Viscosity: > 150.000 mPa.s (Brookfield SSA, SC-25 at 20 rpm)
- Thyxotropic Index > 6 (Brookfield SSA, SC-25 – ratio of 5 rpm / 50 rpm)
- Density 1,3 – 1,45 gr/cc
- 30 “ @ 175°C
- 1 – 2 minutes 150°C
- 5 minutes 120°C
For good mechanical strength, cure according above conditions is recommended, and a minimum of 100°C required. The final bond strength will depend on the residence time at the given cure temperature. Typically, a higher curing temperature, as well as a longer cure time will result in higher adhesion strength, and improved polymer crosslinking.