Kyzen Cybersolv C8882
Understencil Wipe / Stencil Cleaning
Cybersolv C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. Cybersolv C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin, and low residue no-clean fluxes.
Key benefits:
- Removes all flux types
- Fast drying
- non-flammable
- Does not interact or remove nano-coatings
- Compatible to the wetted components of automatic stencil printers