LPKF ProtoLaser U4
Micro Machining in the Lab
LPKF ProtoLaser have been in use in leading electronics laboratories around the wolrd for many years. The LPKF ProtoLaser U4 builds on this experience with numerous applications and expands the process window of it's predecessors.
UV Laser Source as a Versatile Tool
The LPKF ProtoLaser U4 uses a scanner.guided laser developed especially for use in electornics labs with a wavelength in the UV range of 355 nm. At this wavelength, numerous material groups can be easily processed with the laser - wothout the need for additional tools, masks, or films.
Ny laying the structuring fields next to each other ("stitching"), this system has a working area of up to 229 x 305 x 10 mm. With a laser spot size of about 20 μm, it can produce structures with a pitch of 65 μm (50 μm track and 15 μm space) based on FR4 with 18 μm of Cu.
The ProtoLaser U4 features several improvements over the predecessor. The new UV laser source has been designed to have low laser energy level and is stable over a large range of energies. This is especially beneficial for applications with thin films or delicate materials.
An integrated meter determines the actual laser power in the focus position which yields precise actual data for documentation of the production process tracking.
A newly designed rapid vision system has been optimized for laser micro material processing. Fiducials and geometric structures on the substrate can be detected.
The Swiss Army Knife for the Lab
- Easy to use
- Faster determination of machine data
- "Special areas" for higher precision
- Proven LPKF software basis