PARMI SIGMA X
PARMI’s model SIGMA X solder paste inspection system delivers innovative, industry leading performance adding value to your business.
World class measurement technology coupled with the industry’s fastest cycle times and exclusive process support tools maximize your return on investment and your profitability.
Exclusive Dual Laser Technology eliminates shadowing
Compatible with all PCB colors, finishes and HASL
Identifies all features including via holes, edge of board and routing
Inspection speed of 100㎠/sec @ 10x10µm resolution and immediate access to results provides the highest industry throughput
High repeatability and accuracy with measurement height of +/- 1 mm
Key features of 3D sensor RSC VI
Inspection speed increased by 25~30% over RSC 6
SIGMA X Orange: 100cm2/sec @ 10 x 10 µm
SIGMA X Blue: 60cm2/sec @ 10 x 10 µm
Real time PCB warp tracking & warp measuring
Real 3D shape & 2D image
SIGMA X offers a robust feature set including machine intelligence focused on identification and elimination of defects at the root cause.
Process analysis tools, powerful SPC statistical tools and closed loop communications to upstream and downstream processes are designed to solve problems and make your life easier.
PARMI systems are synonymous with high quality design, materials and workmanship. Only leading edge components find their way into the SIGMA X and all sub assemblies are easily accessible for ease of maintenance.