Electrolube HTC - Non-silicone Heat Transfer Compound

  • HTC - Non-silicone Heat Transfer Compound - Nesilikonske paste


Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermalconductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, powerresistors and radiators

Key Properties:

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity