Asscon Multivacuum – The Soldering Process of the Future
The main causes for gaseous voids remaining in the solder joint during later production processes are therefore traced back to the outgassing of components, printed circuit boards and basic materials, as well as reactive gas released in the removal of oxide layers through the fluxing agent.
The multivacuum process helps to effectively remove these voids from the still liquid solder joint by allowing assemblies to be subjected to several independently controllable vacuum processes in a short-term sequence. Multiple successive evacuations shift voids encapsulated in the solder joint in a manner ensuring that they reach its periphery, where they can be removed very effectively. Especially with large soldered joints, this enables the elimination of a significantly greater number of voids than would be the case with a single vacuum operation alone.
The multivacuum process in particular also enables void-free solder joints where products with an above average outgassing potential are concerned (e.g. high number of layers in multilayer, large processors). Gases entering to the solder joint in a first vacuum stage can additionally also be effectively removed from the still liquid solder joint in subsequent vacuum stages.
Besides this the multivacuum process also offers the additional essential advantage of minimizing the risk of soldering defects. If a large void is exposed to vacuum too quickly or if the vacuum is too intense, this can often lead to solder balls, bridging and, in extreme cases, even a dislocation or blowing of, literally, of the components. The multivacuum process now allows these large voids to be exposed to several graded vacuum cycles in an extremely short processing time. This means that the void can be removed from the solder joint in several small steps, obviating the soldering defects mentioned above.
Applications of the Future
The applications of the future will call for electronic assemblies of the highest efficiency. Electromobility, regenerative energies, aerospace, medical and military applications – they all demand top performance from their electronic components. Without an optimal connection of the components which allows for maximum performance whilst simultaneously conducting any generated heat away, meeting these requirements can no longer be assured. The component and connection geometries have already undergone significant change and will also continue to change in future. Power electronics assemblies require correspondingly large connecting pads. But in addition to this they also call for void-free solder joints if the assembly is to achieve maximum efficiency. This makes the task of ensuring void-free solder joints in vacuum soldering processes all the more difficult.
3D-MID applications will also come to play an even more central role in the optimization of electronic components and realization of sustainable products. In this respect, the most extensive void elimination achievable in solder joints using temperatures that are homogenous and as low as possible can only be ensured by vacuum soldering in the vapour phase.
The multivacuum soldering process gives the answer to the challenges of future products and is another milestone from ASSCON in the vacuum soldering technology. It overcomes the limits of modern soldering processes and starts the future of electronic assembling. See for yourself and get convinced of the results that can be achieved with this process!
Multivacuum - the future of soldering.