About SEC
SEC CO., LTD. designs and manufactures industrial X-ray inspection system and scanning electron microscope. Established in 1991, SEC pioneered e-beam control technology and served most advanced inspection & analysis system to customers for laboratory research and quality assurance. SEC prides itself on observing today's ever-changing needs for its customers by providing the most advanced and efficient technology in order to meet customer's production demands. Additionally, SEC goal is to provide the best service and attention to detail in order to exceed customer's needs in a constantly evolving, technological environment.

PCB (Printed Circuit Board)
X-ray inspection is widely used to determine the multi-layer circuit board manufacturing. Using the X-ray inspection technology, the layer hole offset, copper plate inside the hole, pattern open/short can be inspected. With the 3D CT technologies, multi-layer board can be visualized to "layer-by-layer" tomography images.

• Via Hole Align
• Via Hole Copper Wall
• Blind Via Hole
• PCB Pattern Short / Open

SMD (Surface Mounted Devices)
Vision inspection systems can find visible defects on PCBs. However, these systems only check surface errors, not the hidden solder joints of BGA and Flip Chips. X-ray Inspection verifies the integrity of hidden solder joints on surface-mount devices.

• BGA/CSP Short
• BGA/CSP Void
• BGA/CSP Open / Micro Cold Solder
• Solder Ball Crack

Semiconductor
X-ray system penetrates substrate materials non-destructively to expose packaging hidden failures such as void, cracks, component lifting, and other crucial component anomalies.