About Asscon
The Company Asscon Systemtechnik-Elektronik GmbH was founded in 1995 as a development and manufacturing association for progressive and innovative Vapour Phase Reflow Soldering Systems. Since then Asscon pursues their company policy.
Today there are hundreds of Asscon Vapour Phase Soldering Systems installed world wide. This customer base includes some of the most renowned enterprises in the world.

The key advantages of Asscon vapour phase ovens are:

• Soldering in O2 free environment (eliminates the need to use N2)
• Guaranteed control of the max. temperature in the oven due to the physical properties of the liquid used – typically 230oC for Lead Free and 200oC for Sn/Pb boards
• Better heat transfer to the PCB due to the use of liquid for that and not air and N2. This reflects in considerable reduction of electrical power consumption. The maximum power consumption of the smallest oven (Quicky 300) is 2 kW, while the average consumption during soldering is 1 kW. The maximum power consumption of the large inline oven (VP 2000) is 12 kW, while the average consumption during soldering is 6 kW.
• Flexible and easy control of the PCB temperature until reaching the reflow values
• Reduction of the voids in the solder joints. For further decreasing the amount of voids, a vacuum section can be added to the vapour phase systems
• Most complex and demanding PCB’s can be soldered with ovens that cost less compared to the forced convection ovens
• The number of soldering defects is usually smaller