Stencil cleaning
Brochure
Manual or Understencil cleaning
Cybersolv C8622
Cybersolv C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. C8622 is designed to remove solder pastes, spray fluxes and many adhesives used in electronic assembly. Easy to use, C8622 is applied as received in applications where IPA is typically used.
Ionox I3418
Ionox I3418 is a high strength solvent blend designed for stencil cleaning in underscreen wipe systems and hand-wipe applications. CYBERSOLV C3418 is effective in removing all kinds of raw solder paste and uncured print adhesives from stencils while retaining excellent compatibility. This may be followed by a hand wipe or an optional fresh I3418 rinse for complete removal of all soil residues.
Spray in air / Ultrasonic process – EXAKLEAN E5611
Exaklean E5611 is a cost effective cleaning chemistry designed to be diluted for removing flux, solder paste and uncured adhesives from stencils and misprints. Easy to use, E5611 is intended to be effective at low concentrations and low temperatures to provide an economical cleaning solution. EXAKLEAN E5611 has proven compatible with most standard stencil cleaning equipment.
Key benefits
- Designed for spray in air and Ultrasonic Systems
- Successful at cleaning raw paste an uncured adhesives in stencil applications
- Effective at low concentracions
- Use at low temperature
- Compatible with standard stencil cleaning equipment
